Created to perform when the heat is on
Non-Silicone Pastes
Silicone Pastes
RTVs and Bonding Products...
Created to perform when the heat is on
Non-Silicone Pastes
Silicone Pastes
RTVs and Bonding Products
Encapsulation Resins
0.9 to 3.4W/m.K
During use, some electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat away from the component and the device can lead to reliability concerns and reduced operational lifetimes.
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