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PAI Lead Free Bar

At present, there is common consensus from both the industry and the academia that Sn-Ag-Cu alloys will be the primary material for Lead Free solders in the future.

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Nevertheless, this Sn-Ag-Cu alloy still causes production problems and defects in assembly practices; for instance:

Because the Spread and Wetting properties of Sn-Ag-Cu are not as desirable as Sn63/Pb37 alloy`s, it is common to supply with inert gas (nitrogen) to prevent oxidation when re-flowing, which results in De-wetting in SMT assembly process.

In Wave Soldering, the residue produced from Sn-Ag-Cu alloy is much higher than from

Sn63/Pb37 alloy`s, and indirectly causes higher product costs to electronics manufacturers. To overcome these difficulties we introduce you to a 5-element alloy - the Sn-Ag-Cu-Ni-Ge alloy.