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PAI Lead Free Solder Paste Series View full size

PAI Lead Free Solder Paste Series

We also provide lead free micro solder paste for flip chip process.

Suitable for air nitrogen or vapour reflow process

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Characteristics:

  • Pb< 1000ppm, Cd<20ppm.
  • High Print Speed: 0-120 mm/Sec.
  • Over 8 hrs stencil life.
  • Excellent Wettability
  • Low Void
  • Extended Tack Time >12h